A former SK Hynix engineer has been indicted for allegedly stealing advanced semiconductor technology, specifically next-generation high-bandwidth memory (HBM) packaging processes, to transfer to Huawei-affiliated HiSilicon. The employee, identified as Kim, gathered sensitive documents after receiving a job offer from HiSilicon, printing and photographing around 11,000 pages of proprietary data. He was apprehended at Incheon International Airport, facing charges under South Korea’s industrial technology protection laws, which could result in up to ten years in prison.